Bond Elut PCB
Bond Elut PCB SPE from Agilent Technologies
Bond Elut PCB is a specially designed sorbent which allows for the facile extraction of polychlorinated biphenyl (PCB) compounds from a variety of matrices. Desired analytes can be loaded and eluted using a simple, single solvent method prior to analysis by GC/ECD.
All pictures shown are for illustration purpose only. Actual product may vary.
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- Features
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- Optimized bed mass affording excellent extraction reproducibility
- Special dual-phase enhances PCB selectivity
- All extractions can be completed with one solvent to simplify procedures
- Specifications
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Bond Elut PCB Category Application specific Base Material Layered phase Format Packed bed Surface Area 500 m2/g - Literature
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Agilent Bond Elut Speciality SPE Brochure
Agilent Bond Elut Specialty, Disk and Bulk SPE Selection Guide
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Bond Elut Family of SPE Products
Overview of Agilent's Bond Elut product range
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Agilent Sample Preparation Catalogue
Consumable items for sample preparation from Agilent
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