Bond Elut Diol (2OH)
Bond Elut Diol SPE from Agilent Technologies
Bond Elut Diol resembles un-bonded silica in its tendency for strong hydrogen bonding with analytes. 20H can also be employed in the non-polar mode because the hydrocarbon spacer on its functional group provides enough non-polar character for retention of hydrophobic analytes. Bond Elut Diol is a listed SPE device for the DIN 14333-1 method on benzimidazole fungicides.
All pictures shown are for illustration purpose only. Actual product may vary.
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- Features
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- Provides polar and non-polar modes
- Strong hydrogen bonding with analytes
- Resembles un-bonded silica in its capabilities
- Specifications
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Bond Elut Diol (2OH) Category Polar Bonded Functional Group Diol Base Material Silica based Endcapped No Format Packed bed Typical Carbon Loading 6.8% Surface Area 500 m2/g Particle Size 40 µm, irregular Mean Pore Size 60 Å - Literature
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Agilent Bond Elut Silica Brochure
All Silica based SPE phases in the Bond Elut Range from Agilent
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Bond Elut Family of SPE Products
Overview of Agilent's Bond Elut product range
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Agilent Sample Preparation Catalogue
Consumable items for sample preparation from Agilent
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